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Eseye cuts IoT dev time by 75%

Eseye’s new HERA300 modular IoT hardware platform reduces device prototyping time from an average of 12 months down to three months or less.

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The time it takes to develop, prototype and roll out new IoT devices has been dramatically reduced by the new HERA300 modular IoT hardware platform and rapid prototyping methodology from Eseye, the UK-based cellular IoT connectivity specialist.

On average, an IoT device currently takes around 12 months to bring to market. which is a barrier to the success of many IoT projects. The new platform fast-tracks the process from initial idea to a working prototype in a few weeks, maintaining the momentum of an IoT project.

When combined with Eseye’s rapid prototyping methodology, HERA300 allows IoT theories to be tested in their native environments, where real data can be gathered to support operational planning and investment business case requirements. Once the required data is captured, it can be delivered to hyperscale cloud providers, such as AWS, through preferred System Integrator partners, to maximise a wide range of additional IoT services and functionality.

Alongside HERA300, Eseye has developed an eight-step rapid prototyping methodology that enables the rapid build and deployment of IoT devices. From building the initial model, to carrying out iterative test and development stages, resulting in a prototype that can be confidently and successfully deployed immediately into the field. Using Eseye’s methodology removes a significant amount of financial and reputational risk throughout the exploration phase of the project and builds significantly on the likelihood of success for the final approved designs.  

Jon Darley, director of Things at Eseye, says: “With the rapid growth of IoT ideas we recognised the need to create a solution that would embed a technically robust testing process, but also significantly reduce time to market and increase competitive advantage. The HERA300 modular IoT hardware platform and rapid prototyping methodology successfully fulfil this brief and reduce IoT device development time by at least three quarters. This will unlock significant opportunities for companies that wouldn’t otherwise have been able to invest in IoT development with its previously associated costs and time to market.”

The HERA300 platform carries essential functionality on a modular board, meaning the platform can be rapidly adapted to meet the testing requirements and ensure project success. It features multiple sockets allowing for up to five additional sensors or modules to be plugged in, a modem interface, core software architecture including over the air software updates, and built-in temperature, pressure and humidity sensing designed to monitor the board’s environment.

Click here to read more about the HERA300.

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Sony Xperia 5 scores high

The latest compact flagship from Sony, the Xperia 5, scores a high 95 in DxOMark.

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The Sony Xperia 5, announced in September 2019, is the latest compact flagship, intended as a more affordable, pocket-friendly alternative to the full-sized Xperia 1. Key features on the Xperia 5 include a 6.1-inch OLED display, as well as the high-end Snapdragon 855 chipset with 128GB of internal storage and 6GB RAM. Storage is expandable up to 1TB via micro SD.

The main camera boasts the same triple sensor and lens setup as on the Xperia 1. All three sensors offer 12MP resolution, with a large 1/2.55-inch sensor for the main camera, and a smaller 1/3.4-inch sensor for each of the ultra-wide and telephoto modules. The main sensor is coupled to a 26mm-equivalent f/1.6 aperture lens; there’s also a 16mm-equivalent f/2.4-aperture ultra-wide-angle lens, and a 52mm-equivalent f/2.4-aperture lens offering x2 optical zoom shots.

Other features include 5-axis optical image stabilization (OIS) and predictive Dual Pixel PDAF autofocus on the main and telephoto cameras, eye-tracking autofocus, HDR, and LED flash. 4K video is available for 2160p@24/30fps capture on the Xperia 5, but the Sony’s 5-axis gyroscope-enabled OIS only kicks in for HD video recording at 1080p@30fps.

Key camera specifications:

Triple camera

  • Primary: 12MP 1/2.55-inch sensor with 1.4µm pixels and 26mm f/1.6-aperture lens
  • Ultra-wide: 12MP 1/3.4-inch sensor with 1.0µm pixels and 16mm f/2.4-aperture lens
  • Telephoto: 12MP 1/3.4-inch sensor with 1.0µm pixels and 52mm f/2.4-aperture lens
  • Predictive Dual Pixel PDAF autofocus & 5-axis OIS (main & telephoto)
  • LED flash, HDR, eye-tracking
  • 4K 24/30fps video with HDR
  • Full HD 1080p@30fps video with 5-axis gyro-EIS
  • Although not officially launched in South Africa, it is available from some online outlets.

Click here to see samples of the photography on DxOMark’s website.

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Qualcomm launches new Snapdragon chips for 4G

Three new chipsets by Qualcomm, the Snapdragon 720G, 662, and 460, have been released to address the growing need for faster 4G and Wi-Fi 6 connectivity.

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Qualcomm Technologies has launched three new mobile chipsets: the Qualcomm Snapdragon 720G, 662 and 460, which enable enhanced connectivity, gaming and entertainment experiences. They enable fast 4G connectivity speeds, deliver key Wi-Fi 6 features, and integrated Bluetooth 5.1. They also support Dual-Frequency (L1 and L5) GNSS to improve location positioning accuracy and robustness, and are the first system-on-chip solutions to support Navigation with Indian Constellation (NavIC) – India’s regional answer to GPS.

“While we see a fast adoption of 5G across geographies globally, we do recognise the phenomenal boost that 4G has given towards enabling broadband connectivity for Indian consumers,” said Rajen Vagadia, president of Qualcomm India. “4G will continue to remain a focus area for Qualcomm Technologies for regions like India, where it will stay a key technology for connectivity. Our goal is to enable our partners to continue creating solutions that offer seamless connectivity access and exceptional mobile experiences, that consumers can count on.”

Kedar Kondap, vice president for product management at Qualcomm Technologies, said: “Today’s smartphone users want fast, seamless connectivity, advanced features and long-lasting battery life. This expansion of our 4G lineup enables our partners to offer sophisticated solutions that meet global demand and enable a remarkable gaming experience across multiple tiers and price segments.”

For the first time supported on mobile, the Qualcomm Location Suite now supports up to seven satellite constellations concurrently, including the use of all of NavIC’s operating satellites, for more accurate location performance, faster time-to-first-fix (TTFF) position acquisition, and improved robustness of location-based services.

Snapdragon 720G creates better gaming and entertainment experiences, with some high-end Qualcomm Snapdragon Elite Gaming features, picture capture capabilities, and intelligent performance. Qualcomm says the 720G delivers smooth HDR gameplay, dynamic colour range and contrast, realistic and immersive in-game environments, and high-quality, synchronised sound with Qualcomm aptX Adaptive. In addition to gaming, users can experience a home theatre on-device with HDR viewing and smooth video streaming with the Qualcomm Spectra 350L ISP. One can also capture 4K video or snap 192-megapixel photos.

It also features the latest 5th generation Qualcomm AI Engine with an improved Qualcomm Hexagon Tensor Accelerator, which will enable a host of new AI experiences for gaming, photography, voice assistants, and virtually always-on contextual awareness.

The integrated Snapdragon X15 LTE modem supports 3-carrier aggregation, 4×4 MIMO on two carriers and 256-QAM modulation for fast download speeds up to 800 Mbps – allowing for quick app downloads and smooth video streaming and sharing. In addition, it doubles Wi-Fi speed and range, compared to single antenna devices, while also delivering key Wi-Fi 6 features such as 8×8 sounding with multi-user MIMO for up to 2x improvement over competitive Wi-Fi 6 devices.

The Snapdragon 662 adds new camera and AI capabilities to the 6-series for the first time. It will feature the new Qualcomm Spectra 340T, which supports triple camera configurations and smooth switching between them — a first in the 6-series.

The addition of the 3rd generation Qualcomm AI Engine with Hexagon Vector Extensions enables AI-based user experiences such as avatars, night photography, and face and voice authentication.

It also features the new Snapdragon X11 LTE modem with peak download speeds up to 390 Mbps thanks to 2-carrier aggregation, 2×2 MIMO and 256-QAM modulation, along with 150 Mbps peak uploads to support a snappy web browsing and social media experience.

The Snapdragon 460 boasts a leap in performance across the board in the 4-series, as well as significant boosts in connectivity, AI and camera improvements for the next-generation of mid-range smartphones. For the first time in the 4-series, Snapdragon 460 features performance CPU cores and an updated GPU architecture that translates into up to 70% and 60% increase in performance from the previous generation, respectively.

The Qualcomm Spectra 340 ISP is also among the many new additions to the 4-series, enabling the platform to capture sharp photographs and support for triple cameras. An integrated Snapdragon X11 LTE modem allows for download speeds up to 390 Mbps and uploads up to 150 Mbps.

Devices based on Snapdragon 720G are expected to be commercially available in Q1 2020 and devices based on Snapdragon 662 and 460 are expected to be commercially available by the end of 2020.

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