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Fujifilm X-Pro3 packs quality into rugged body

With a highly rugged camera body, Fujifilm’s new X-Pro3 allows photographers to shoot in daring situations with less stress.

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Fujifilm has announced it will be launching the X-Pro3 in November, as the latest flagship model for the X Series range of mirrorless digital cameras.

This camera has been used by professionals to shoot documentaries and for reportage photography because of the classic rangefinder-style, portability, and dials that enable intuitive operation.

According to Fujifilm, The X-Pro3 features one of the most durable camera bodies on the market, thanks to the use of titanium on the body. Apart from the regular black body, improved DR Black and DR Silver versions will also be available. These have the surface-hardening Duratect technology applied to achieve a Vickers hardness rating up to 1500Hv to protect the camera from scratches.

To ensure that the right level of performance and image quality for a flagship model is met, it uses the back illuminated 26.1MP X-Trans CMOS 4 sensor and the X-Processor 4 image-processing engine, first seen in the FUJIFILM X-T3 and then the FUJIFILM X-T30. Using this combination and new firmware, the phase-detection auto-focus (AF) now works down to a luminance of -6EV, which is close to pitch darkness.

The X-Pro series is known for an Advanced Hybrid Viewfinder, which allows users to switch between the optical viewfinder (OVF), providing a constant view of the subject without any time lag, and the electronic viewfinder (EVF), which lets one check exposure while shooting. 
It features a 1.62-million-dot high-resolution tilting LCD touchscreen display, which can flip almost 180 degrees, allowing users to shoot from the hip, at ground level or with the camera above their heads.

On the back of the panel is a very useful feature: a 1.3-inch colour Memory LCD, which displays shooting settings regardless of whether the camera is turned on or not. The screen can be set in the Classic mode, which displays the current Film Simulation, white balance and other image settings similar to film cameras.

Users can also find all the Film Simulation options that Fujifilm has managed to incorporate, due to its understanding of colour gained over 85 years in the industry. New to this is what it calls Classic Neg Film Simulation, which simulates colour negative film that was normally used for everyday snapshots. The colours are precisely controlled for each level of brightness, to create a rich chromatic contrast that adds extra definition to the image.

The Grain Effect function, which simulates grain achieved with film, has been improved so that users can adjust strength and size to attain a more precise control over graininess, instead of having just the two options of graininess of previous models.

Price and Availability

Fujifilm X-Pro3 will be available in South Africa at the end of November 2019, with a recommended retail price of approximately R24,000 for the body only.

For further information, visit https://fujifilm-x.com/global/it-ch/products/cameras/x-pro3/.

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Qualcomm launches new Snapdragon chips for 4G

Three new chipsets by Qualcomm, the Snapdragon 720G, 662, and 460, have been released to address the growing need for faster 4G and Wi-Fi 6 connectivity.

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Qualcomm Technologies has launched three new mobile chipsets: the Qualcomm Snapdragon 720G, 662 and 460, which enable enhanced connectivity, gaming and entertainment experiences. They enable fast 4G connectivity speeds, deliver key Wi-Fi 6 features, and integrated Bluetooth 5.1. They also support Dual-Frequency (L1 and L5) GNSS to improve location positioning accuracy and robustness, and are the first system-on-chip solutions to support Navigation with Indian Constellation (NavIC) – India’s regional answer to GPS.

“While we see a fast adoption of 5G across geographies globally, we do recognise the phenomenal boost that 4G has given towards enabling broadband connectivity for Indian consumers,” said Rajen Vagadia, president of Qualcomm India. “4G will continue to remain a focus area for Qualcomm Technologies for regions like India, where it will stay a key technology for connectivity. Our goal is to enable our partners to continue creating solutions that offer seamless connectivity access and exceptional mobile experiences, that consumers can count on.”

Kedar Kondap, vice president for product management at Qualcomm Technologies, said: “Today’s smartphone users want fast, seamless connectivity, advanced features and long-lasting battery life. This expansion of our 4G lineup enables our partners to offer sophisticated solutions that meet global demand and enable a remarkable gaming experience across multiple tiers and price segments.”

For the first time supported on mobile, the Qualcomm Location Suite now supports up to seven satellite constellations concurrently, including the use of all of NavIC’s operating satellites, for more accurate location performance, faster time-to-first-fix (TTFF) position acquisition, and improved robustness of location-based services.

Snapdragon 720G creates better gaming and entertainment experiences, with some high-end Qualcomm Snapdragon Elite Gaming features, picture capture capabilities, and intelligent performance. Qualcomm says the 720G delivers smooth HDR gameplay, dynamic colour range and contrast, realistic and immersive in-game environments, and high-quality, synchronised sound with Qualcomm aptX Adaptive. In addition to gaming, users can experience a home theatre on-device with HDR viewing and smooth video streaming with the Qualcomm Spectra 350L ISP. One can also capture 4K video or snap 192-megapixel photos.

It also features the latest 5th generation Qualcomm AI Engine with an improved Qualcomm Hexagon Tensor Accelerator, which will enable a host of new AI experiences for gaming, photography, voice assistants, and virtually always-on contextual awareness.

The integrated Snapdragon X15 LTE modem supports 3-carrier aggregation, 4×4 MIMO on two carriers and 256-QAM modulation for fast download speeds up to 800 Mbps – allowing for quick app downloads and smooth video streaming and sharing. In addition, it doubles Wi-Fi speed and range, compared to single antenna devices, while also delivering key Wi-Fi 6 features such as 8×8 sounding with multi-user MIMO for up to 2x improvement over competitive Wi-Fi 6 devices.

The Snapdragon 662 adds new camera and AI capabilities to the 6-series for the first time. It will feature the new Qualcomm Spectra 340T, which supports triple camera configurations and smooth switching between them — a first in the 6-series.

The addition of the 3rd generation Qualcomm AI Engine with Hexagon Vector Extensions enables AI-based user experiences such as avatars, night photography, and face and voice authentication.

It also features the new Snapdragon X11 LTE modem with peak download speeds up to 390 Mbps thanks to 2-carrier aggregation, 2×2 MIMO and 256-QAM modulation, along with 150 Mbps peak uploads to support a snappy web browsing and social media experience.

The Snapdragon 460 boasts a leap in performance across the board in the 4-series, as well as significant boosts in connectivity, AI and camera improvements for the next-generation of mid-range smartphones. For the first time in the 4-series, Snapdragon 460 features performance CPU cores and an updated GPU architecture that translates into up to 70% and 60% increase in performance from the previous generation, respectively.

The Qualcomm Spectra 340 ISP is also among the many new additions to the 4-series, enabling the platform to capture sharp photographs and support for triple cameras. An integrated Snapdragon X11 LTE modem allows for download speeds up to 390 Mbps and uploads up to 150 Mbps.

Devices based on Snapdragon 720G are expected to be commercially available in Q1 2020 and devices based on Snapdragon 662 and 460 are expected to be commercially available by the end of 2020.

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Nissan showcases Leaf Nismo electric racing car

All-electric Nissan Leaf Nismo RC racing car makes European debut at Circuit Ricardo Tormo in Valencia, Spain.

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Nissan’s expertise in electric vehicles and high-performance vehicles have come together in the Nissan Leaf Nismo RC.

The all-wheel-drive Leaf Nismo RC boasts more than double the maximum power and torque output of its predecessor, which was based on the first-generation Leaf and revealed in 2011. Delivering 322hp and 640Nm of instantly available torque, it offers lightning-quick acceleration, achieving the 0-100km/h sprint in just 3.4 seconds.

The creation of the latest Leaf Nismo RC is not just for show; it acts as a testbed for future technological evolution and showcases the potential of Nissan electric vehicles. It explores what can be achieved with an all-electric twin-motor and all-wheel-drive drivetrain.

It shares its advanced technology with the Leaf road car, and touched down in Europe for the first time at Circuit Ricardo Tormo in Valencia, Spain.

“Nissan’s experience as a pioneer in electric vehicles for the road, combined with Nismo’s 60-plus years of motorsport innovation, led to the conception of a unique car,” says Michael Carcamo, Nissan Global Motorsport Director. “For Nissan, the ‘E’ in ‘EV’ also stands for ‘Exciting’. Putting this philosophy front and centre, we created the Leaf Nismo RC. It amplifies the fun-to-drive aspect of electric mobility, raising the thrills offered by EVs to a new level.”

As with the Leaf Nismo RC, instant acceleration is a feature of every Nissan EV model. The all-electric powertrains offer a fast driving experience that is complemented by the Leaf’s intelligent design and advanced connectivity.

For more details on NISMO and Formula-e: https://www.nismo.com/

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